J'ai postulé via un établissement d'enseignement supérieur ou universitaire. J'ai passé un entretien chez iLenSys en janv. 2023
Entretien
It consists of two rounds,both are technical interviews , first round is about fundamentals in the core subjects and it is a elimination round. Second round is about depth in the core subjects and it is also a elimination round,it is very difficult compared to the first round.
Questions d'entretien [1]
Question 1
Questions are about the core subjects mentioned in the resume
J'ai postulé via une agence de recrutement. Le processus a pris 2 semaines. J'ai passé un entretien chez iLenSys (Hyderâbâd) en août 2019
Entretien
Schematic symbols creation using OrCAD Capture 17.2
Bill Of material and net list creation
Footprint creation considering IPC Standard.
Net list Importing to the Layout
Setting up the DRC rule as per PCB Fabricator capability
Placement of the layout (as per Routing, Placement Guidelines)
Checking the Layout with QC Engineers
Preparation of Gerber, NC Drill files for PCB fabrication
Support to PCB manufacturer regarding Stack up as this board having high speed, multiple impedance requirements and metal core PCB
J'ai passé un entretien chez iLenSys (Hyderâbâd) en juill. 2012
Entretien
It consisted of two rounds.
First round was a written test. It consisted of fundamental questions.
Second round was Technical & personal interview.
In the second round they asked questions like
tell me about yourself and then questions based on resume like describe about your project, can you show us how first angle projection is represented. basic questions of drawing.