Man, the interview at Lenovo’s Cyberport office was intense but honestly pretty cool. The lead engineer didn't hold back—he went straight for the technical throat. He handed me a laptop chassis and asked me to identify potential stress points and explain how I’d optimize the airflow path to prevent thermal throttling. We spent a good chunk of time debating material fatigue in hinge designs. He also grilled me on DFM (Design for Manufacturing), basically asking, "It looks good on your CAD screen, but how the hell do we mass-produce this in Shenzhen without the costs skyrocketing?" The vibe was professional but fast-paced. He seemed less interested in my grades at CityU and more in how I’d handle a real-world hardware failure under a tight deadline. By the end, my brain was fried, but I think I nailed the logic behind my cooling system proposal.